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700-038 Advanced Collaboration Architecture(R) field Engineer

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700-038 exam Dumps Source : Advanced Collaboration Architecture(R) field Engineer

Test Code : 700-038
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Cisco Cisco Advanced Collaboration Architecture(R)

LaSalle options Renews Cisco superior Collaboration architecture Specialization | killexams.com existent Questions and Pass4sure dumps

March 06, 2018 15:00 ET | supply: LaSalle solutions

ROSEMONT, sick., March 06, 2018 (GLOBE NEWSWIRE) -- LaSalle solutions, a number one issuer of know-how lifecycle management capabilities, announced these days that it has renewed its Cisco advanced Collaboration architecture Specialization. The specialization recognizes that LaSalle has again fulfilled the practicing necessities and software necessities to promote, design and installation comprehensive Cisco Collaboration options.

As a Cisco superior Collaboration Specialization partner, LaSalle solutions has validated its talent to deliver refined, value-delivered Cisco options via in-depth earnings capabilities, expertise skills and repair offerings. Cisco advanced Specialization partners drudgery with original and existing technologies to align components of these architectures with their purchasers’ strategic desires, helping seriously change trade strategies, extend organizational effectivity and accelerate up the time to market.

“we're disdainful to once again achieve superior Collaboration structure Specialization from Cisco,” stated Steven Robb, president of the solutions neighborhood at LaSalle options. “Our shoppers look to us for succor improving collaboration throughout their agencies. This specialization is because of the the tough drudgery LaSalle solutions places in each year to Make sure that they possess the top-rated applied sciences and talents to bring up client collaboration techniques to extra sustainable, unified options.”

About LaSalle options

centered in 1980, LaSalle options is a leading company of technology lifecycle asset management features. LaSalle allows for its customers to enrich their know-how operations via improved approaches, administration and reporting for stronger planning and revert on funding. LaSalle solutions’ methods, brilliant consumer provider and powerful, market-leading cloud-based toolset, LAMP, permit shoppers to attain better company effects through transparency and accountable outcomes at their fingertips.

LaSalle options is a division of MB device Finance LLC, a subsidiary of MB economic bank, N.A., a trade monetary institution headquartered in Chicago. MB economic Inc. is the publicly traded protecting trade for MB economic monetary institution, N.A. and is traded on the NASDAQ as “MBFI.”

For extra information on LaSalle options, tickle visit www.elasalle.com and www.YouTube.com/LaSalleSolutions.

LaSalle solutions and LAMP are registered emblems of LaSalle solutions within the united states.

Press Contact Beth Kirshenberg LaSalle solutions 847.823.9600

Rosemont, Illinois, u.s.

Press Contact Beth Kirshenberg LaSalle options 847.823.9600 LaSalle Solutions Logojpg_1200pxw.jpg

formats accessible:


LaSalle options once again Achieves superior Collaboration architecture Specialization From Cisco in the u.s. | killexams.com existent Questions and Pass4sure dumps

ROSEMONT, IL--(Marketwired - March 03, 2015) - To guide the increasing office of collaboration options that leverage the intelligence of the network, LaSalle options announced nowadays that it has accomplished the superior Collaboration structure Specialization from Cisco. This specialization acknowledges LaSalle options as having fulfilled the training requirements to sell, design and installation comprehensive Cisco® Collaboration architecture solutions.

As a Cisco superior Collaboration structure really excellent associate, LaSalle solutions has invested in the training required to convey differentiated enterprise expense throughout the built-in, open basis of the collaboration architecture. Cisco advanced Collaboration architecture specialized partners drudgery with original and latest applied sciences to align add-ons of this structure with their shoppers' strategic dreams, assisting transform enterprise techniques, enhance organizational effectivity and accelerate the time to market.

"we're disdainful to once again achieve the Cisco superior Collaboration structure Specialization," says Steven Robb, President of the solutions group at LaSalle solutions. "This continuing schooling and partnership is a mutual ongoing commitment, as Cisco requires annual renewal for this and a lot of other specializations. we are disdainful to proceed their dedication, and deem this focus displays their dedication to providing the crew, tactics and gear to deliver the advanced solutions their consumers possess arrive to reckon on, and enable us to exceed expectations to meet synchronous enterprise challenges and construct their competitive side."

The Cisco Resale Channel application offers partners with the practicing required to build earnings, design and technical talent and then validates their knowledge via a third-celebration audit.

This recertification builds on a few Cisco-related milestones LaSalle options has prior to now executed, including:

  • Cisco US features associate of the yr: latest
  • customer satisfaction Excellence Gold superstar: latest, 40 Consecutive Quarters. 
  • Cisco® Gold licensed partner
  • Cisco master Unified Communications Specialization
  • Cisco grasp protection Specialization
  • international companion network companion
  • superior statistics core structure Specialization
  • advanced without frontier lines community structure Specialization 
  • ATP - Cisco TelePresence Video superior
  • ATP - records Virtualization Reseller
  • ATP - power administration Suite Integrator
  • ATP - identification functions Engine
  • Cisco capabilities associate of the 12 months, central place: 2010 - 2013
  • About LaSalle options

    based in 1980, LaSalle solutions is a leading company of lifestyles-cycle administration capabilities for expertise and capital property. These functions involve acquisition and financing, IT asset management, upkeep constrict administration, remarketing and disposition. LaSalle solutions' procedures, marvelous client service and robust, market-main cloud-based mostly toolset, LAMP, permit clients to more economically and simply control and map to fulfill their dreams.

    LaSalle solutions is an independently operated company and a subsidiary of MB monetary bank, a publicly traded Chicago-based bank keeping business. MB monetary is traded on the NASDAQ as "MBFI".

    For greater counsel on LaSalle solutions, tickle visit www.elasalle.com and www.YouTube.com/LaSalleSolutions.

    LaSalle solutions and LAMP are registered logos of LaSalle solutions within the united states. Cisco and the Cisco emblem are emblems or registered logos of Cisco and/or its associates in the U.S. and different countries.


    CompuCom® Re-certifies as Cisco® Gold and master Collaboration licensed associate in the u . s . a . | killexams.com existent Questions and Pass4sure dumps

    DALLAS--(company WIRE)--CompuCom techniques, Inc. (“CompuCom”), a number one know-how infrastructure services business, nowadays announced that it has re-licensed as a Cisco Gold and grasp Collaboration certified ally within the united states of america. Cisco notified the enterprise that it had met every requirements as a Cisco Gold and master Collaboration certified ally for the personnel, succor and specialization CompuCom offers as an IT capabilities company. Cisco tested that CompuCom has confirmed that it is certified to promote, installation and succor Cisco options in the u . s . a ..

    Cisco Gold Certification presents the broadest range of skills across high-growth market opportunities referred to as “structure performs” for trade Networking, protection, Collaboration, records core Virtualization and SP expertise. Gold certified companions possess furthermore integrated the deepest degree of Cisco Lifecycle features potential into their choices and display a measurably extravagant stage of customer satisfaction. The grasp Collaboration Specialization demonstrates the optimum degree of abilities with Collaboration options convey Voice and Unified Communications solutions to succor their valued clientele speak at once and with no trouble, and extend customer provider whereas saving time and cash.

    CompuCom certified for Gold Certification in accordance with 4 specializations: advanced trade Networks structure Specialization; advanced safety architecture Specialization; advanced Collaboration structure Specialization; and superior statistics headquarters architecture Specialization.

    In Collaboration, CompuCom attained the Cisco Collaboration grasp really excellent companion application, the maximum smooth of specialization.

    “we are completely satisfied to proceed their song listing of Cisco Gold Certification because it recognizes the value of CompuCom’s consulting potential in composite with Cisco’s advanced applied sciences and capabilities,” CompuCom’s David hall, executive vice chairman of professional functions, commented. “This smooth of technical talents and an unlimited array of use-case experiences allows us to carry exceptional options and better trade value. The outcome is client pride, the goal for both of their groups.”

    About CompuCom

    CompuCom systems, Inc., a world enterprise headquartered in Dallas, Texas, gives IT managed services, infrastructure options, consulting and products to Fortune one thousand companies dedicated to improving their cessation users’ journey. established in 1987, privately held CompuCom employs about 11,500 associates. For extra tips, consult with www.compucom.com.

    © 2016 CompuCom techniques, Inc. every rights reserved. CompuCom® is a registered trademark of CompuCom programs, Inc.

    Cisco® is a registered trademark of Cisco programs, Inc., and is used with permission


    700-038 Advanced Collaboration Architecture(R) field Engineer

    Study guide Prepared by Killexams.com Cisco Dumps Experts


    Killexams.com 700-038 Dumps and existent Questions

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    Test Code : 700-038
    Test name : Advanced Collaboration Architecture(R) field Engineer
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    CLOVER, S.C. (PRWEB) October 15, 2018

    The Lake Wylie Recreation Park officially broke ground Friday at 1101 field Day Lane in Clover, S.C. The $9.5 million, 32-acre athletic complicated was designed by Woolpert on Crowders Creek in the Paddlers Cove subdivision and will subsist open to the community.

    The original park will tender sports and recreation amenities that involve three multipurpose synthetic turf fields; three baseball/softball fields; pickleball courts; a edifice to house scorers, restrooms and concessions; a community building; walking trails; shelters; and a playground. The community park furthermore will subsist able to host local athletic leagues and tournaments, which can drive economic development in the region.

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    "This project is being completed through a progressive design-build contract, which is more of an open-book collaboration concept that allows for transparency and flexibility between the three key players in a construction contract--the owner, the designer and the contractor," said Andrew Pack, Woolpert vice president and Education and Athletics practice leader. "Not many municipalities operate under these contracts to build parks, but it serves their needs well. They worked with J.D. Goodrum on the recently completed Sportsplex at Matthews (N.C.) and a handful of other parks in the region. We're excited to subsist able to provide this for the community of York County."

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    The Semiconductor Industry Is in Transition | killexams.com existent questions and Pass4sure dumps

    Companies are beginning to avow the potential of original markets and downstream revenue opportunities as they explore a more comprehensive “silicon to services” model that spans the data headquarters to the mobile edge. More specifically, with eroding ASPs (average selling prices) and increasingly prohibitive design costs at ever lower nodes, many companies are searching for fresh revenue streams across a wide range of verticals comprising the Internet of Things (IoT).

    However, with the IoT install groundwork expected to extend by about 15% to 20% annually through 2020, security is currently perceived as both a major break and a considerable challenge for the semiconductor industry.

    In addition to services, the concept of open-source hardware (OSH) and edifice silicon from disaggregated, pre-verified chiplets is beginning to gain earnest traction as companies scramble to slash costs and reduce time-to-market for heterogeneous designs.

    Specific strategies to unlocking the plenary potential of silicon and services will undoubtedly vary, which is why it’s famous for us to explore a future in which semiconductor companies, along with various industries, organizations, and government offices, play an open and collaborative role in helping to sustainably monetize both silicon and services.

    Acquisitions and industry consolidation continued apace in 2016 and 2017:

  • Analog Devices acquired Linear Technology
  • Infineon acquired International Rectifier
  • ROHM acquired Powervation
  • Renesas acquired Intersil
  • Major semiconductor players positioned themselves to better compete across multiple verticals, including cloud-based computing, synthetic intelligence (AI), and self-driving vehicles. According to KPMG, many companies increasingly see Mergers & Acquisitions (M&A) as the only course to drive existent revenue growth, giving a original emphasis to the “make vs. buy” question, with many selecting the “buy” answer.

    Concurrently, chip development costs continued to climb and saliently affect the number of designs at advanced nodes. More specifically, the total number of Advanced Performance Multicore first-time SoC design starts has been roughly flat to only slightly up over the past five years. Although design expense tags possess been steadily increasing since 40 nm, analysts are most concerned with the acceleration of design costs at 7 nm and 5 nm.

    As moneyed Wawrzyniak, a senior analyst at Semico Research confirms, design starts beyond 10 nm will subsist constrained by rising development costs. While the total number of designs that migrate to original nodes may not subsist appreciably different than previous process geometry upgrades, Wawrzyniak says the time frame for such transitions by the majority of companies will subsist more protracted.

    New models for both R&D and revenue are clearly needed, as heightened industry consolidation and eroding ASPs are unsustainable in the long term. This is precisely why the industry is looking toward the Internet of Things to create additional revenue streams, with McKinsey Global Institute (MGI) analysts estimating the IoT could possess an annual economic impact of $3.9 to $11.1 trillion by 2025 across multiple verticals. However, with the IoT install groundwork expected to extend by about 15% to 20% annually through 2020, security is considered to subsist both a major break and challenge for semiconductor companies.

    As such, MGI recommends creating security solutions that allow for semiconductor companies to expand into adjacent trade areas and develop original trade models. For example, companies could succor create end-to-end security offerings, which are essential to the IoT’s success. Ideally, says MGI, the industry should play a leading role when developing such offerings, to ensure they obtain their objective share of the value chain.

    From their perspective, end-to-end IoT security solutions deployed as a platform as a service (PaaS) are censorious in helping semiconductor companies generate renewable, downstream revenue for specific services. For customers, PaaS offers an light course for customers to securely develop, run, and manage applications and devices without the complexity of edifice and maintaining intricate infrastructure.

    Such security solutions, which could furthermore leverage a hardware-based root-of-trust, should support device identification and mutual authentication (verification), routine attestation checks, secure over-the-air (OTA) device updates, disaster recovery and key management, as well as the decommissioning and reassignment of keys to better manage devices and mitigate various attacks, including distributed denial of service (DDoS).

    Smart Cities

    Inaccessible silicon—such as chips embedded in IoT smart-city infrastructure—could tender semiconductor companies the break to implement a long-term PaaS “silicon to services” model. Indeed, future smart-city infrastructure will almost certainly subsist designed with chips in difficult-to-reach locations, including subterranean water pipes, air-conditioning ducts, and under streets and parking lots.

    Intelligent street lighting, responsive signage, and next-gen Bluetooth beacons furthermore require future-proofing to avoid constant physical maintenance and upgrades. Therefore, silicon powering smart-city infrastructure should subsist capable of supporting secure in-field feature configuration, along with various PaaS-based services dote advanced analytics, predictive maintenance alerts, self-learning algorithms, and intelligent, proactive interaction with customers.

    Smart Homes

    The global smart-home market is projected to achieve at least $40 billion in value by 2020. According to Markets and Markets, the growth of the smart-home space can subsist attributed to multiple factors, including significant advances in the IoT sector; increasing requirements for consumer convenience, safety, and security; a more pronounced exigency for energy-saving, and low-carbon-emission-oriented solutions. However, as they previously discussed, it’s censorious to ensure that IoT security is implemented at the product design stage to obviate malicious actors from exploiting smart-home devices and causing service interruptions.

    In addition to potentially lucrative cybersecurity opportunities for semiconductor companies, smart-home devices tender the covenant of creating recurring revenue streams to support a sustainable “silicon to services” model. As an example, MarketingInsider's Christoper Dean highlights Amazon’s accepted reflect devices. With at least 15 million Echoes already sold, reflect users are likely to double as lively Amazon consumers, leveraging the device to monitor wishlists and determine items they’re subsequently prompted to purchase. Meanwhile, Nest is using thermostat data as a platform to tender energy-management services to utility companies across the United States, with companies paying for meaningful and actionable customer information on a subscription basis.

    Automotive

    According to IC Insights, chip sales for automotive systems and the IoT will grow 70% faster than total IC revenues between 2016 and 2021. Specifically, IC sales for automobiles and other vehicles are forecast to jump from $22.9 billion in 2016 to $42.9 billion in 2021, while revenues for IoT functionality will extend from $18.4 billion in 2016 to $34.2 billion in 2021.

    The projected extend in automotive chip sales is hardly surprising, as modern vehicles are essentially a network of networks equipped with a range of embedded communication methods and capabilities. However, this means vehicles are now more vulnerable to cyberattacks than ever before.

    Potential security vulnerabilities involve unprotected vehicle-to-vehicle communication, the unauthorized collection of driver or passenger information, seizing control of censorious systems such as brakes or accelerators, intercepting vehicle data, tampering with third-party dongles, and altering over-the-air (OTA) firmware updates. In terms of the latter, automotive manufacturers are now focusing on providing secure OTA updates for various systems, with the global automotive OTA update market projected to grow at a CAGR of 18.2% from 2017 to 2022 and achieve $3.89 billion by 2022.

    Automotive manufacturers are furthermore working to ensure that the vehicle supply chain is kept free of stolen and counterfeit components. Nevertheless, a wide range of gray-market devices can soundless subsist establish powering high-value modules such as in-vehicle infotainment systems and headlights, as well as in censorious safety systems including airbag modules, braking modules, and powertrain controls. Shielding vehicle peripherals and components against tampering by implementing a range of layered hardware and software security solutions possess therefore become a priority for a number of automotive manufacturers.

    In addition to implementing layered security solutions, the semiconductor industry would clearly profit from adopting an IoT "as-a-service" approach to the automotive sector. As an example, companies could deploy sensor-based vehicle systems that proactively detect potential issues and malfunctions. This solution, which, in its most optimal configuration, would combine silicon and services, could subsist sold as a hardware and software product, or deployed as a service with subscription fees generated on a monthly or annual basis.

    Medical and Healthcare

    Long-life implanted medical devices will undoubtedly require a high degree of future-proofing from the semiconductor industry to avoid frequent physical upgrades and maintenance. Srihari Yamanoor, an R&D design specialist at Stellartech Research Corp., notes that medical devices will ultimately subsist customized to meet the needs of individual patients, thereby increasing the application of precision medicine.

    Moreover, the health insurance industry is expected to leverage machine learning to optimize and reduce the cost of care, while digital health devices will furthermore subsist used by the insurance industry to identify at-risk patients and provide assistance. Medical devices, especially implantable models, should therefore subsist designed to support a “silicon to services model” via in-field feature configuration and secure OTA updates, as well as PaaS-based services, including the collection and analysis of germane data; proactive maintenance, advanced algorithms; and an intuitive UI for both patients and doctors.

    Open-Source Hardware and Disaggregated Chiplets

    Alongside services, open-source hardware offered by organizations and companies such as RISC-V and SiFive possess begun to positively disrupt the semiconductor industry by encouraging innovation, reducing development costs and accelerating time-to-market.

    The success of open-source software—as opposed to a closed, walled-garden approach—continues to set an famous precedent for the semiconductor industry. Faced with prohibitively expensive development costs, a number of companies are opting to avoid unnecessary toll collectors while placing more of an emphasis on open-source architecture as they drudgery to create original service-centric revenue streams.

    In addition to open-source hardware, the concept of edifice silicon from pre-verified chiplets is beginning to gain traction as the semiconductor industry moves to slash costs and reduce time-to-market for heterogeneous designs. According to Semiconductor Engineering's Ann Steffora Mutschler, the chiplet concept has been on the drawing board for some time, although it was historically perceived as a potential future direction rather than a tangible solution in the shadow of waning Moore’s Law. This perception is beginning to shift as design complexity increases, particularly at advanced nodes (10/7 nm), and as original markets that require semi-customized solutions coalesce.

    The concept of pre-verified chiplets has piqued the interest of the U.S. Defense Advanced Research Projects Agency (DARPA), which recently rolled out its Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. In collaboration with the semiconductor industry, the successful implementation of CHIPS would see a range of IP blocks, subsystems, and chips combined on an interposer in a 2.5D-like package.

    The CHIPS initiative took headquarters stage in August 2017, when participants from the military, commercial, and academic sectors gathered at DARPA headquarters at the official kickoff meeting for the Agency’s Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies program.

    As DARPA's Dr. Daniel Green circumstantial during the conference, the program seeks to develop a original technological framework in which different functionalities and blocks of intellectual property—among them, data storage, computation, signal processing, and managing the profile and rush of data—can subsist segregated into diminutive chiplets. They then can subsist mixed, matched, and combined onto an interposer, more or less dote joining the pieces of a jigsaw puzzle. In fact, says Green, an entire conventional circuit board with a variety of different but full-sized chips could ultimately subsist shrunk down onto a much smaller interposer hosting a huddle of yet far smaller chiplets.

    According to DARPA, specific technologies that could emerge from the CHIPS initiative involve compact replacements for entire circuit boards, ultra-wideband radio frequency (RF) systems, and fast-learning systems for extracting appealing and actionable information from much larger volumes of mundane data.

    Perhaps not surprisingly, the semiconductor industry is already eyeing a disaggregated approach in the profile of SerDes chiplets and specialized low-power, application-specific die-to-die interfaces. To subsist sure, viable silicon disaggregation can subsist achieved by moving high-speed interfaces dote SerDes to sever die in the profile of SerDes chiplets, shifting analog sensor IP to sever analog chips and implementing very low-power and low-latency die-to-die interfaces through MCM or through an interposer using 2.5D technology.

    Beyond leveraging known-good die for SerDes in more develope nodes (N-1) or vice versa, disaggregation is expected to facilitate the creation of multiple SKUs, while optimizing cost and reducing risk. More precisely, disaggregation will see SoCs broken out into higher-yielding, smaller dies and allow companies to create specific designs with multiple variants. Indeed, die-to-die interfaces can more easily accommodate diverse applications across memory, logic and analog technology. In addition, die-to-die interfaces don’t require a matching line/baud rate and number of lanes, while FEC may or may not subsist required depending on latency requirements.

    It should subsist illustrious that multiple companies are actively pursuing SoC/ASIC aggregation for switches and other systems. Similarly, the semiconductor industry is developing ASICs with die-to-die interfaces on leading FinFET nodes, while at least one next-generation server chip is being designed with disaggregated I/Os on a sever die.

    Conclusion

    Over the past five years, the semiconductor industry has faced numerous complicated challenges. These involve increased development costs, eroded ASPs, market saturation, and heightened, yet unsustainable M&A activity. Through 2018, the semiconductor industry continues to hunt a revert to stability and organic growth within the parameters of a original trade paradigm that’s both viable and collaborative. Within this context, semiconductor companies are acknowledging the potential of original markets and downstream revenue opportunities as they explore a more comprehensive “silicon to services” model that spans the data headquarters to the mobile edge.

    This includes end-to-end IoT security solutions and PaaS-based services such as in-field feature configuration, advanced analytics, predictive maintenance alerts, self-learning algorithms, and intelligent, proactive interaction with customers. In addition to services, the concept of open-source hardware and edifice silicon from disaggregated, pre-verified chiplets is beginning to gain traction as companies scramble to slash costs and reduce time-to-market for heterogeneous designs.

    Specific strategies to unlocking the plenary potential of semiconductors will undoubtedly vary, which is why it’s famous for us to explore a future in which the industry, along with various research organizations and government offices, plays an open and collaborative role in helping to sustainably monetize both silicon and services.

    For more information on this topic, check out Rambus’ site.

    Shrikant Lohokare, Ph.D., is Vice President and Executive Director, North America for the Global Semiconductor Alliance.


    IoT savvy is already translating into market success | killexams.com existent questions and Pass4sure dumps

    We're no longer designing and running solutions that meet the requirements of internal and external customers that directly access their systems and information. This support needs to extend to external customers' customers as well. The Industrial Internet of Things is reshaping the course goods and services are delivered, dramatically shifting the relationship between companies and customers -- and the roles IT leaders exigency to play.

    Also: Harnessing IoT in the Enterprise Special Feature

    That's the word from Tom Leeson, industry and marketing value strategist for manufacturing at OpenText, who has been involved in the manufacturing sector throughout his career. I recently had the break to sit down with Leeson at the OpenText's recent Enterprise World conference, who pointed out that thanks to IoT and automation, manufacturers possess no election but to subsist digital. Manufacturing is the industry that collects the most amount of data on a daily basis."

    The automotive industry is going to subsist an entirely different industry within the next few years, built on IoT networks, software, data and constrict manufacturing, Leeson illustrates. "Electric vehicles carry weight a huge shift, creating original data challenges, with connected vehicles as fraction of the connected world. This is actually an exciting time to subsist in the industry."

    For every manufacturers, the Industrial IoT means a climb in AI-assisted predicted maintenance, in which companies will sense when issues may occur with products in the field and proactively deliver software updates or dispatch maintenance teams. "The next evolution of analytics will no longer subsist predictive, it will subsist prescriptive," Leeson points out. "We're not just going to forecast maintenance, were going to avoid maintenance." As result, IT needs to subsist "100% operational to cope with the demands of the customer and deliver customer satisfaction."

    As he establish it: "If they can succor their customer's customer, then their customer will trust us for life." The course this happens is data streaming in from the end-user product -- such as an elevator system -- is automatically analyzed for anomalies -- we';re more interested in the 1% than the other 99%," Leeson explains. "If they point heuristically to failure, you dispatch the service engineers with the birthright part. When the service engineer arrives, they are wearing a carcass camera, and has access to the back office database, every the documentation, every the manuals, and previous training videos to Make that service call." Companies who possess these advanced capabilities "have the competitive advantage," he adds.

    For manufacturers going forward, "the product is only 50% of the deal," he adds. With data flowing from sensors within products and locations, there is break to provide value-added services to customers.

    Also: How IoT is reinventing IT architecture TechRepublic

    A recent survey by McKinsey explored the opportunities companies are seeing as a result of IoT. Those companies achieving scale in IoT often did so not by entering unfamiliar territory -- such as a manufacturer becoming a software company, but by playing to their strengths. "IoT leaders, the group getting the most economic profit from IoT, were nearly three times more likely to add IoT connectivity to existing products they sell than the laggards were," the McKinsey team, lead by Michael Chui, observe. "Conversely, laggards--those in the bottom quintile of economic returns--were significantly more likely to focus on developing original IoT products or services."

    Chui and his co-authors cite examples of Industrial IoT in action:

  • Building an external customer platform. An agricultural-equipment manufacturer "shifted R&D investments to IoT-enabled products and services in existing lines of business" that used farm-based sensors to read soil conditions continuously and monitor irrigation levels, sending data to a cloud-based analytics platform. "As the manufacturer added users, the growing trait and breadth of data improved the predictive capabilities of the system, further increasing value to farmers who joined the ecosystem."
  • Building internal collaboration. A metals manufacturer connected three rolling mills with sensors in an IoT deployment to capture and anatomize previously unused data from the machines. To promote adoption by frontline employees. the company modified a range of plant-floor processes, to "enable line operators to recognize immediately when bottlenecks in the process were forming," as well as cheer greater collaboration to resolve problems. "This metals manufacturer erudite that, in order to maximize IoT value, people possess to behave differently, Make decisions differently, and operate in a original usual of rapid information flow.."
  • IoT isn't something companies should attempt to travel it alone, Chui and his co-authors caution. "Technical IoT ecosystems are growing -- and improving -- by the day. Collaboration, often with smaller players that possess high levels of expertise in areas such as software development, will provide a solid source of competitive advantage. That will succor companies accelerate their programs and better position themselves to become IoT leaders."

    (Disclosure: I was a guest at OpenText Enterprise World, mentioned in this post.)



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